The CAMM is a component of the Small Scale Systems Integration and Packaging Center (S3IP), a New York State Center of Excellence. S3IP is a research and development center that addresses challenges in small scale systems design, development, prototyping, process development and manufacturing for the microelectronics industry. The Center coalesces some of Binghamton University’s resources, including the Integrated Electronics Engineering Center (IEEC), a NYS Center of Advanced Technology, internationally renowned for its leading edge research in electronics packaging; the Center for Advanced Microelectronics Manufacturing (CAMM), a national roll-to-roll manufacturing R&D center; the Center for Advanced Sensors and Environmental Systems (CASE), focused on sensors, sensor systems and environmental technologies; and the Institute for Materials Research (IMR); focused on research on new materials and their characterization.

The Center is establishing new laboratory facilities that will answer New York State industry needs for instrumentation necessary to commercialize microelectronic applications. These facilities will provide expertise that will support materials diagnostics, analysis, and characterization studies for research in such areas as electronics systems integration and packaging, materials, and flexible electronics. The lab will also support life sciences research in medical diagnostics, security systems for pathogen detection, “smart textiles”, and additional industrial and consumer applications, both directly as well as through related emerging technologies. Further information is available here