The CAMM is a component of the Small Scale Systems Integration and Packaging Center, A New York State Center of Excellence
 
 
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Annual Flexible Displays & Microelectronics Conference held in Phoenix, AZ on January 21-24, 2008.

Binghamton University and the USDC teamed up for the annual Flexible Displays & Microelectronics Conference held in Phoenix, AZ on January 21-24, 2008.  There was a call for papers for the Academic & Fundamental Research Track.  There was also a Student poster session.

 

Texas Instruments - Packaging Technology Trends-"Applied Research Opportunities" Special presentation given by Mario A. Bolanos after our CAMM EAB/TAB Meeting on 3/22/07

 

CAMM at USDC Phoenix-Feb 2007

 

USDC launches initiative aimed at developing the flexible, printed and organic electronics market-December 2006

 

Annual IEEC and CAMM Dinner-November 2006

 

The 2 proposals that have been chosen are:

  1.   Howard Wang: Materials and Processing for Inkjet Printing Fabrication of Flexible Electronics;
  2.   C.J. Zhong and Susan Lu: Roll-to-Roll Fabrication of Flexible Sensor Arrays on Polymer Substrates.
 
 

First CAMM Technical Advisory Board Meeting - July 12, 2006

 
The first CAMM Technical Advisory Board (TAB) meeting was held on Wednesday, July 12, from 11:00 am - 3:00 pm at Binghamton University's Innovative Technologies Complex. The meeting provided the opportunity for the Center's industrial and academic partners to begin discussions on developing research priorities to address roll-to-roll flexible electronics manufacturing challenges that the CAMM will focus on during the upcoming year.

Future Electronics in Research (Press and Sun Bulletin, February 20, 2006)

 

CAMM highlighted at USDC Flexible Displays and Microelectronics Conference, February 7-9, 2006.

More than 300 display and electronics industry leaders, key government officials and top members of academia convened in Phoenix, Ariz., from Feb. 7-9 to offer insights and to learn more about the individual and collaborative efforts under way toward bringing flexible displays and microelectronics to market.

 

Binghamton University's Integrated Electronics Engineering Center receives $1.7 M from the New York State Office of Science, Technology and Academic Research.

The funds will enable the IEEC to work more closely with the new Center for Advanced Microelectronics Manufacturing (CAMM) on commercializing flexible and low-cost electronics based on roll-to-roll manufacturing. 

 

Congressional Briefing held on Capitol Hill

A team from Binghamton University's Center for Advanced Microelectronics Manufacturing (CAMM) discussed critical next-generation applications in the microelectronics industry at a Research Foundation sponsored Capitol Hill briefing on Monday, June 6., 2005. Bahgat Sammakia, CAMM Director, Mark Poliks, Senior Engineer, Endicott Interconnect Technologies, and M. Robert Pinnel, Chief Technology Officer, US Display Consortium updated congressional staffers on how the CAMM will enable advancement in application areas such as military and homeland security, medical diagnostics, flexible displays and electronics, computer and telecommunications, and consumer projects. The luncheon series, which is being held in the Rayburn House Office Building in cooperation with Rep. Sherwood Boehlert, is designed to help New York's Congressional Delegation and other national decision makers stay informed of the vitally important research and scholarship that is taking place at SUNY.

 

First Organizational Meeting of CAMM held on Binghamton University Campus

The first organizational meeting of the CAMM was held at Binghamton University on January 18, 2006. The meeting allowed partners to participate in the early stages of the CAMM's development and provide valuable input into the strategic planning process.

 
 

Binghamton University Wins R&D Contract from the U.S. Display Consortium for Roll-to-Roll Manufacturing

Binghamton University and the U.S. Display Consortium (USDC) today announced that the University has been awarded a competitively bid contract from the USDC to establish and operate the Center for Advanced Microelectronics Manufacturing (CAMM). 

 
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