 Seungbae Park received his Ph.D. at Purdue University in 1994. Dr. Park began his professional career at IBM Microelectronics Division as a development engineer in Endicott, New York. Later he was engaged in the reliability engineering responsible for the reliability of IBM’s corporate flip chip technology in both leaded and lead-free solders and high performance packaging. After 7 years at IBM Microelectronics Division, Dr. SB Park started his academic career at Binghamton University in 2002. He has more than 50 technical publications and holds 4 US patents. Dr. Park served for several technical committees including member of JEDEC 14-1 Reliability Committee. He has been chairing iNEMI Modeling and Simulation TWG, “Electronics Packaging” council in Society of Experimental Mechanics, “Emerging technology” track in ITHERM 2006, and “Electronics and Photonics Packaging” track of IMECE 2007. Dr. Park’s research interest is physical reliability or microelectronics and MEMS packaging.
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