The CAMM is a component of the Small Scale Systems Integration and Packaging Center, A New York State Center of Excellence
 
 
s3ip logo
 

 

 

 

 

 

 

 

 

 

 

Home > Facilities
 
 

Binghamton University’s Center for Advanced Microelectronics Manufacturing is housed at the University’s facility at Endicott Interconnect Technologies, Inc. The facility consists of a 10,000 sq.ft clean room in Building 258-3 Technology Laboratory. The facility will include an integrated roll-to-roll flexible electronics prototype manufacturing line, and associated microfabrication and electronics laboratories.

CAMM's Facility at Endicott Interconnect Technologies
CAMM Tools
Tools
Azores Corporation Model 6600 FlexPrinter
CHA industries High-Vacuum Deposition System
Clean Room
Energy Conversion Devices Defect Inspection
Hollmuller Siegmund Photoresist Proccesing
KDF In-line Sputter Down Batch Deposition System
Kraemer Koating Wet Process/Cleaning
Northfield Automation R2R Web Handling Systems
Panel Laboratory
General VAcuum/BoBst High- Vacumm Coater
Tamarack System 303 Scanning Projection Lithigraphy System
 

© 2006 Center for Advanced Microelectronic Manufacturing at Binghamton University. All Rights Reserved.