Awards and Honors:

• Member of Tau Beta Pi Engineering Honor Society.
• Post Doctoral fellowship, University of Pennsylvania; funded by the Samuel Landis Gabel endowment, 1982-1983.
• Five IBM awards for publications excellence, 1987 to 1992.
• Seven IBM awards for inventions filed, 1988 to 1996.
• Four IBM awards for invention plateaus reached, 1988 to 1994.
• Formal IBM division award for excellence in technical, people and business management, 1992.
• Two IBM informal awards for excellence in technology development, 1996.
• Elected as an ASME Fellow, 1997.
• “IBM Blue Chip Award for Top Performers,” 1997.                
• Received IBM stock options, 1997 and 1998.
• Motorola award, “Silver Quill Award,” for joint publication of the Mechanical Engineering Handbook CRCnetBASE, 2001.
• State University of New York Chancellor’s Award for Outstanding Contributions to Research, 2002.
• State University of New York Chancellor’s Promising Inventor Award for novel approaches in thermal management-using nano-structured materials and the invention of thin bilayer coatings for electronics, 2003.
• State University of New York Partners in Excellence Award, recognized by the Chancellor for work resulting in the Formation of the High Technology Commercialization Center, 2004.
• Received the ASME-K16 Committee on Heat Transfer of Electronics and the Electronic and Photonic Packaging Division Clock Award for outstanding and continuing contributions to the Science and Engineering of Heat Transfer in Electronics, 2004.
• IEEE CPMT Society Board of Governors, 2006-07.
• Received the 2007 American Society of Mechanical Engineering Division award for the Electronics Packaging and Photonics Division (EPPD) for excellence in the area of Thermal Management of Electronic Systems