Patents 

  • Funari, Joseph., Mary C. Green., Scott D. Reynolds., and Bahgat G. Sammakia. Electronic package with improved heat sink.  1989. US Pat.  4,849,856.
  • Anschel; Morris, Bahgat G., Sammakia.  Electronic package with heat spreader member. 1990.  US Pat.  4,914,551.
  • Baker; Don L., Joseph Funari., William F. Otto., Bahgat G. Sammakia., and Randall J. Stutzman.  Electronic assembly with enhanced heat sinking.  1991. US Pat.  5,003,429.
  • Ameen, Joseph G., Joseph Funari, Bahgat G. Sammakia, David W. Sissenstein, Jr., and Samuel L. Smey.  Epoxy composition and use thereof.  1991. US Pat.  5,028,984.
  • Funari, Joseph., Terence C. Godown., Scott D. Reynolds., and Bahgat G. Sammakia.  Pluggable electronic circuit package assembly with snap together heat sink housing. 1992. US Pat.  5,109,318.
  • Anschel, Morris., Anthony P. Ingraham., Charles R. Lamb., Michael D. Lowell., Voya R. Markovich., Wolfgang Mayr., Richard G. Murphy., Mark V. Pierson., Tamar A. Powers., Timothy S. Reny., Scott D. Reynolds., Bahgat G. Sammakia., and Wayne R. Storr.  Method and apparatus for testing of integrated circuit chips.  1995. US Pat.  5,420,520.
  • Mok, Lawrence S.-W., Sampath Purushothaman., Bahgat G. Sammakia., Janusz S. Wilczynski., and Tien Y. Wu.  Electronic package having active means to maintain its operating temperature constant.  1996. US Pat.  5,491,610.
  • Kosteva, Stephen J.,  Bahgat G. Sammakia., Assembly mounting techniques for heat sinks in electronic packaging. 1999. US Pat. 5,870,285.
  • Sammakia, Bahgat, G., Sanjeev Balwant Sathe., Electronic Packages and Method to Enhance the Passive Thermal Management of Electronic Packages.  1999. US Pat. 5,912,800.
  • Sammakia, Bahgat, G., Sanjeev Balwant Sathe., Electronic Packages and a Method to Improve Thermal Performance of Electronic Packages.  1999. US Pat. 5,966,290.
  • Sammakia, Bahgat G., Sanjeev Balwant Sathe.  Electronic Packages and a Method to Improve Thermal Performance of Electronic Packages. 2000. US Pat.  6,058,015.
  • Sammakia, Bahgat G., Sanjeev B. Sathe.  Method for using Pulsating Flow to Improve Thermal Transport in Systems.   2001. US Pat.  6,219,234.
  • Junghyun Cho, Scott Oliver, Wayne Jones, Bahgat Sammakia, Surface Coating for Electronic Systems, 2007, US Pat 7,282,254,B1.

 

IBM Invention Disclosures

  • A Transient Test of the Temperature Coefficient of Resistance for CERMET Resistors, EN885-0182, 1988.
  • Substrate Temperature Measurement using Integral Surface Resistors, EN885-0158, 1988.
  • Flexible Heat Sink, EN887-0171, 1988.
  • Thermally Enhanced Surface Mount Modular Tape Automated Bonding Package,” EN887-0255, 1989
  • Lead Planarity Compensator for Inner Lead Bonders,” EN887-0551, 1990.
  • Alignment Technique by Cu Etching for Solder Attaching Chips to TAB, EN887-0502, 1991.
  • Improved High Density Area Array Contact Design, EN893-0269, 1994.
  • Impingement Heat Sink, AT893-1081, 1994.
  • Densely Populated, Vertically Stacked Multi Chip Module, EN893-0062, 1995.
  • High Conductivity Fibrous Heat Sink, AT894-0320, 1995.

 

 
                                            Tel: 607 777-6880    
Bahgat G. Sammakia              bahgat@binghamton.edu