• Gebhart, B., Y. Jaluria, R. Mahajan and B. G. Sammakia.  Buoyancy Induced Flows and Transport, Hemisphere Pub. Corp., 1988. Translated to Russian in 1991.
• Seraphim, D., R. Lasky, Li, and B. Sammakia.  “Thermal Enhancement.”  Principles of Electronic Packaging, McGraw-Hill, 1989.
• Sammakia, B., K. Ramakrishna, “Thermal Management in Electronic Packaging and Systems.”  Mechanical Engineering Handbook CRCnetBASE.  2001. Frank Kreith (Editor), CRC Press, Boca Raton, FL.  <http://www.engnetbase.com>.
• Puttlitz, Karl and Paul Totta, eds. “Thermal management.”  Area Array Interconnection Handbook , Kluwer Academic Publishers, 2001.  <www.wkap.nl>.
• Andros, F.E., B. Sammakia.  “Integrated Circuit Packaging.”  Encyclopedia of Physical Science and Technology,   3rd ed. Vol. 7.  Academic Press, 2001.

Refereed Conference Proceedings  

• Gebhart, B., B. Sammakia, and T. Audunson, eds.  Transport Near a Horizontal Ice Surface Melting in Cold Saline Water presented in the Sea Ice Margins Symposium at the XVIII IUGG General Assembly.  Hamburg: Federal Republic of Germany, 1983.
• Sammakia, Bahgat.  Unsteady Mixed Convection in Air, a Numerical and Experimental Study: Proceedings of  the ASME Winter Annual Meeting, ASME Proceedings, Forum on Unsteady Flows. New Orleans, LA1984:43-45.
• Sammakia, Bahgat.  Modeling of Arctic Sea Ice Formation and Dissipation: Proceedings at an ASME Conference, Arctic and Offshore Mechanics Symposium. New Orleans, LA 1984.
• Khalilolahi, Amir, M. H. Hamza, and B. Sammakia, eds.  Transient Natural Convection Generated by a Hot Vertical Surface within an Enclosure: Proceedings IASTED International Conference, Applied identification modeling and simulation, AIMS 84, ISBN0-88986-070-X, (1984): 141-145.
• Biber, C. and B. Sammakia, eds.  Transport from Discretely Heated Components in a Turbulent Channel Flow:  Proceedings at the ASME Winter Annual Meeting.  Anaheim, CA, 86-WA/HT-68, 1986.
• Homa, T., B. Sammakia, and P. Vadala, eds.  A Transient Technique to Measure the Thermal Coefficient of Resistance for Thin Films ASME Winter Annual Meeting. Boston, MA. 87-WA/EEP-4, 1987.
• M. Coleman, B. Sammakia, and Dereje Agonafer, Unsteady Buoyancy Induced Flow in an Enclosure ASME Winter Annual Meeting. Boston, MA, 87-WA/EEP-10, 1987.
• Khalilolahi, Amir and B. Sammakia, eds.  Transient Mixed Convection In Air Adjacent To Discrete Uniform Flux Heat Sources: Proceedings of the ASME Symposium on Numerical Simulation of Convection in Electronic Equipment Cooling. HTD-Vol. 121, San Francisco, CA, 1989.
• Khalilolahi, Amir and B. Sammakia, eds.  Transient Convection Adjacent to Discrete Components in the Presence of a Weak Opposing Pressure Field:  Proceedings of the ASME Winter Annual Meeting.  Dallas, TX, 1990.
• Subbarayan, Guhan, K. Ramakrishna, B.G. Sammakia and P.C. Chen, eds. Mechanical Integrity of VIAS in a Thin-Film Package during Manufacturing, Assembly and Stress Test: Proceedings of IEEE Electronic Components and Technology Conference (ECTC). Orlando, FL, 1993.
• “The Impact of Interfacial Adhesion on PTH and VIA Reliability,” G. Subbarayan, K. Ramakrishna and B.G. Sammakia, EEP-vol. 11/MD-vol. 64, Application of Fracture Mechanics in Electronic Packaging and Materials, ASME 1995.
• “Analysis of Strains in Plated Through Holes During Current Induced Thermal Cycling of a Printed Wiring Board,” K. Ramakrishna and B.G. Sammakia, 1995 ASME International Mechanical Engineering Congress and Exposition, San Francisco, CA., 95-WA/EEP-5.
• “Natural Convection in an Open Ended Horizontally Heated Cavity:  A Numerical Study with Applications to Laptop Computers,” S. Sathe and B.G. Sammakia, HTD-vol. 303, pp. 81-93, 1995, National Heat Transfer Conference-vol. 1.
• “A numerical study of a high performance air-cooled impingement heat sink,” S. Sathe, B.G. Sammakia, A.C. Wong and V. H. Mahaney, HTD-vol. 303, pp. 43-53, 1995 National Heat Transfer Conference-Vol. 1.
• “A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) package,” S. Sathe and B.G. Sammakia, National Heat Transfer Conference, 1996.
• “Macro and Micro Thermal Model of an Elevated Temperature Dielectric Breakdown in Printed Circuit Boards,” Randall Stutzman, Sanjeev Sathe and Bahgat Sammakia, presented at the ASM 22nd International Symposium for Test and Failure Analysis (ISTFA 96), Los Angeles CA, 1996.
• “Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry,” W.T. Chen, D. Questad, D. Read, and B.G. Sammakia, presented at the ASME WAM in 1997.
• “Void Modeling in Encapsulated Multilayer Ceramic and Multilayer Polyimide Ceramic Flip Chip Packages,” T.M. Niu, B.G. Sammakia and S. Sathe.  Presented at the Itherm 98, Seattle, WA, May 1998.
• “Adhesion Issues in Flip Chip on Organic Modules,” S.K. Tran, D. Questad and B.G. Sammakia, presented at the Itherm 98 Seattle, WA, May 1998.
• “Some Thermal Issues that Arise in the Development, Qualification, and Manufacturing of Electronic Packages,” Sanjeev Sathe and Bahgat Sammakia, presentation at the NSF/ASME Workshop in conjunction with the 1998 ASME International Mechanical Engineering Congress and Exposition, pp. 8-11, November 18-19, 1998 .
• “Thermal Issues that Arise due to Manufacturing Processes; Evaluation and Measurement Techniques,” Bahgat Sammakia and Sanjeev Sathe, Electronics Manufacturing Issues, DE-Vol. 104, ASME 1999, pp. 121-138, November 14-19, 1999.
• “Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package,” Sanjeev B. Sathe and Bahgat G. Sammakia, Proceedings of ASME 1998, Manufacturing Science and Engineering Division, MED-Vol. 8, pp. 747-756, 1998.
• “Computational Parameter Study of Chip Scale Package Array Cooling,” Sean P. Watson, Bruce T. Murray, Bahgat G. Sammakia, Proc. 2000 InterSociety Conference on Thermal Phenomena (Itherm 2000), pp. 37-43, Las Vegas, NV, May 23-26, 2000
• “Parametric Studies of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package,” Sandeep S. Tonapi, K. Srihari, Sanjeev B. Sathe, Bahgat G. Sammakia, Proceedings of the ASME Manufacturing in Engineering Division - 2000, MED-Vol. 11, pp. 425-431, Orlando, FL, November 5-10, 2000.
• “Current and Future Research in Electronics Packaging at Binghamton University,” James E. Morris, Bahgat Sammakia, 2000 Government Microcircuit Applications Conference, pp. 396-399, Anaheim, CA, March 20-23, 2000.
• “A Shear Strength Study of Lead-Free Solder Spheres for BGA Applications on Different Pad Finishes,” Prashant Chouta, Daryl Santos, Hari Srihari, Bahgat Sammakia, Frank Andros, and Mike DiPietro, 2001 Proceedings Pan Pacific Microelectronics Symposium, pp. 11-28, Kauai, HI, February 13-16, 2001.
• “Thermal Model of Buried Resistors and Design Guidelines for Buried Components,” S. Sathe and B. Sammakia, EEP-Vol. 26-1, Advances in Electronic Packaging – 1999, Volume 1, ASME 1999.
• “Selection of Method for Fatigue Life Prediction Under Random Loading”, Amit Awasthi, Stephen McKeown, Chittaranjan Sahay, and Bahgat Sammakia, IMECE 2001, session EEP-12, November 2001, New York, N.Y.
• “Industry University Research in Electronics Manufacturing: The Binghamton University Model,” D.L. Santos, K. Srihari and Bahgat Sammakia, proceedings of the SMTA-Chicago (October 2001). 
• “Parametric Studies of the Thermal Performance of Back-to-Back Tape Ball Grid Array (TBGA) Packages,” Tonapi, S., Sathe, S., Sammakia, B. G., and Srihari, K, 51st ECTC, Orlando, FL, May 2001, pp. 738-743.
• “An FEA Study of Image Transfer in Printed Wiring Boards,” P. Greenfield, J. Andresakis and B. Sammakia, IPC 2002, pp S03-2-1 – S03-2-8.
• “A lamination study of a composite LCD flat panel display,, by Phil Greenfield, James Pitarresi, Gary Lehmann, Dean Skinner, John Lee and Bahgat Sammakia, proceedings InterSociety Conference on Thermal Phenomena (Itherm2002), San Diego, CA.
• “A numerical analysis of the performance of a parallel plate heat sink,” Amit Shah, Bahgat Sammakia, Hari Srihari, and K. Ramakrishna, proceedings InterSociety Conference on Thermal Phenomena (Itherm2002), San Diego CA, May 2002.
• "Comparative Analysis of two heat spreader designs for a Wire Bond TBGA Package,” Satish Guttikonda and Bahgat Sammakia, proceedings InterSociety Conference on Thermal Phenomena (Itherm2002), San Diego CA.
• “A parametric study of the thermal performance of chip scale packages with flat plate heat sinks,” Sean Watson and Bahgat Sammakia, proceedings InterSociety Conference on Thermal Phenomena (Itherm2002), San Diego CA.
• “A Parametric Predictive Solder Joint Reliability Model for Wafer Level Chip Scale Package,” S. Chaparala, J. Pitarresi, B. Sammakia, L. Nguyen, V. Patwardhan, L. Zhang, N. Kelkar, Proceedings ECTC 2002.
• “Industry - University Partnership In Graduate Research and Education,” H. Srihari and B. Sammakia, Proceedings ECTC 2002.
• "An Overview of Thermal Management of Next Generation Microelectronic Devices,” S. S. Tonapi, R. Fillion, B. Sammakia, F.J. Schattenmann, H.S. Cole,  J. D. Evans, Proceedings of the 13th Advanced Semiconductor Manufacturing Conference 2003, 250
• S. Mahajan, G. Subbarayan, B.G. Sammakia, and W. Jones, “Molecular Dynamics Simulation of Nanotube Polymer Composites for use as Thermal Interface Material,” Proceedings of 2003 ASME, International Mechanical Engineering Congress and Exposition, Washington, D.C., November 15-21, 2003
• Sanjeev Sathe and B.G. Sammakia, “An Analytical Study of the Optimized Performance of An Impingement Heat Sink,” Proceedings of 2003 ASME, International Mechanical Engineering Congress and Exposition, Washington, DC, November 15-21, 2003 .
• Anand Desai, Sanket Mahajan, Ganesh Subbarayan, Wayne Jones, James Geer, Bahgat Sammakia, “An Analytical Study of Transport in a Thermal Interface Material Enhanced with Carbon Nanotubes,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 403-409, Las Vegas, NV, June 1-4, 2004.
• Satish C. Chaparala, Brian D. Roggeman, James M. Pitarresi, Bahgat G. Sammakia, John Jackson, Garry Griffin, Tom McHugh, “Effects of Geometry and Temperature Cycle on the Reliability of WLCSP Solder Joints,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 287-295, Las Vegas, NV, June 1-4, 2004.
• Gayatri Cuddalorepatta, James M. Pitarresi, Bahgat G. Sammakia, “Mechanical Modeling of Tiled Liquid Crystal on Silicon (LcoS) Microdisplay,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 383-390, Las Vegas, NV, June 1-4, 2004.
• Damena Agonafer, Jason Markell, Bahgat Sammakia, Gary Lehman, “Numerical Investigation of Enclosure Effects on Spot Cooling Devices,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 339-343, Las Vegas, NV, June 1-4, 2004.
• S.B. Park, Bahgat Sammakia, Karthik Raghunathan, “Predictive Model for Optimized Design Parameters in Flip-Chip Packages,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 458-464, Las Vegas, NV, June 1-4, 2004.
• Anupam Choubey, Frank Andros, Bahgat Sammakia, “Study of Assembly Processes for Liquid Crystal on Silicon (LcoS) Microdisplays,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 77-84, Las Vegas, NV, June 1-4, 2004.
• Raj Bahadur, Bahgat Sammakia, Frank Andros, “Thermal Management of a Microdisplay Engine Assembly,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 381-388, Las Vegas, NV, June 1-4, 2004.
• Saurabh Shrivastava, Bahgat Sammakia, “Thermal Management of Biomaterials in a Rectangular Cavity Surrounded by a Phase Change Material,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 108-120, Las Vegas, NV, June 1-4, 2004.
• Parthiban Arunasalam, Harold D. Ackler, Bahgat G. Sammakia, “Smart Three Axis Compliant (STAC) Interconnect: An Ultra-High Density MEMS Based Interconnect for Wafer-Level Ultra-Thin Die Stacking Technology,” ECTC 2005, 5/31-6/3/2005, Lake Buena Vista, FL.
• Parthiban Arunasalam, Harold D. Ackler, Sandeep Makhar, Bahgat G. Sammakia, “A Novel MEMS Based Ultra-High Density Interconnect for Wafer-Level Ultra-Thin Die Stacking Technology,” IMAPS 2005, September 25-29, 2005, Philadelphia, PA.
• S.B. Park, Rahul Joshi, Bahgat Sammakia, “Thermomechanical behavior of organic and ceramic flip chip ball grid array packages under power cycling,” Semi-Therm 2005, March 15-17, San Jose CA.
• X. Zhang1, S. Kanuparthi, G. Subbarayan, B. Sammakia, S. Tonapi, “Hierarchical Modeling and Trade-off Studies in Design of Thermal Interface Materials,” Proceedings ASME InterPACK '05, IPACK2005-73259, July 17-22, 2005, San Francisco, CA
• Siddharth Bhopte, Dereje Agonafer, Roger Schmidt, Bahgat Sammakia, “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature,” Proceedings ASME InterPACK '05, IPACK2005-73027, July 17-22, 2005, San Francisco, CA
• Saurabh Shrivastava, Bahgat Sammakia, Roger Schmidt, Madhusudan Iyengar, “Comparative Analysis of Different Data Center Airflow Management Configurations,” Proceedings ASME InterPACK '05, IPACK2005-73235, July 17-22, 2005, San Francisco, CA
• Saurabh Shrivastava, Bahgat Sammakia, “Transient Mixed-Convection with Applications to Cooling of Biomaterials,” Proceedings ASME InterPACK '05, IPACK2005-73235, July 17-22, 2005, San Francisco, CA
• Madhusudan Iyengar, Roger Schmidt, Arun Sharma, Gerard McVicker, Saurabh Shrivastava, Sri Sri-Jayantha, Yasuo Amemiya, Hien Dang, Timothy Chainer, and Bahgat Sammakia, “Thermal Characterization of Non-raised Floor Air Cooled Data Centers Using Numerical Modeling,” Proceedings ASME InterPACK '05, IPACK2005-73387, July 17-22, 2005, San Francisco, CA
• Satish C. Chaparala, Frank E. Andros, Bill Infantolino, Bahgat G. Sammakia, Satish C. Guttikonda, Julia Zhao, Dipak Sengupta, “Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP),” Proceedings ASME InterPACK '05, IPACK2005-73085, July 17-22, 2005, San Francisco, CA
• Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Roggeman, Bahgat G. Sammakia, Luu Nguyen, “Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly with Sn3.9Ag0.6Cu SAC Alloy,” Proceedings ASME InterPACK '05, IPACK2005-73239, July 17-22, 2005, San Francisco, CA
• Saurabh Shrivastava and Bahgat Sammakia, “Inclined Cavity Effects with Applications to Cooling of Biomaterials,” Proceedings of IMECE2005, Paper IMECE2005-81633, November 5-11, 2005, Orlando, FL.
• Saurabh Shrivastava, Bahgat Sammakia, Madhusudan Iyengar, Roger Schmidt, “Significance Levels of Factors for Different Airflow Management Configurations of Data Centers,” Proceedings of IMECE2005, Paper IMECE2005-81607, November 5-11, 2005, Orlando, FL.
• Anand Desai, James Geer, Bahgat Sammakia, “Analytical Model of Heat Conduction in a Tubular Geometry with Application to a Nano-Structured Thermal Interface,” Proceedings of IMECE2005, Paper IMECE2005-79732,  November 5-11, 2005, Orlando, FL.
• Anand Desai, James Geer, Bahgat Sammakia, “Heat Conduction in Three Dimensional Stacked Packages,” Proceedings of IMECE2005, Paper IMECE2005-79771, November 5-11, 2005, Orlando, FL.
• Kanuparthi, S., X. Zhang, G. Subbarayan, B. Sammakia, A. Gowda, and S. Tonapi., “Full-Field Simulations of Particulate Thermal Interface Materials: Separating the Effects of Random Distribution from Interfacial Resistance,” 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006.
• “Thermal Conductivity of Amorphous Silica Using Non-Equilibrium Molecular Dynamics Simulations,” S. Mahajan, G. Subbarayan, B.G. Sammakia, 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006.
• “Random Network Percolation Models for Particulate Thermal Interface Materials,” S. Kanuparthi, X. Zhang, G. Subbarayan, B.G. Sammakia, T. Siegmund, A. Gowda, S. Tonapi, 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006.
• “Experimental-Numerical Comparison for a High-Density Data Center:  Hot Spot Fluxes in Excess of 500 W/FT2,” Saurabh K. Shrivastava, Madhusudan Iyengar, Bahgat G. Sammakia, Roger Schmidt, James W. VanGilder, 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006.
• “A Statistical Prediction of Cold Aisle End Airflow Boundary Conditions,” Saurabh K. Shrivastava, James W. VanGilder, Bahgat G. Sammakia, 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006.
• “Effect of Under Floor Blockages on Data Center Performance,” Siddarth Bhopte, Bahgat Sammakia, Roger Schmidt, Madhusudan K. Iyengar, Dereje Agonafer, 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006.
• “A Statistical Analysis of Thermal Interface Materials Enhanced by Vertically Aligned Carbon Nanotubes,” Anand Desai, James Geer, Bahgat Sammakia, 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006.
• “Design, Fabrication and Implementation of Smart Three Axis Compliant Interconnects for Ultra-Thin Chip Stacking Technology,” Parthiban Arunasalam, Harold D. Ackler, Bahgat G. Sammakia, 56th Electronic Components and Technology Conference Proceedings, pp. 1147-1153, San Diego, CA, May 30-June 2, 2006.
• “A Technical Review of Studies on Temperature Distribution in Three Dimensional Stacked Packages”, A. Desai, J. Geer and Bahgat Sammakia, Thermes 2007: Thermal Challenges in Next Generation Electronic Systems, Suresh V. Garimella and Amy, S. Fleischer (editors), 2007, Millpress, Rotterdam, ISBN 978-90-5966-051-9.
• “Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package,” Anand Desai, James Geer and Bahgat Sammakia, Proceedings of IPACK 2007, IPACK2007-33045, Vancouver, BC, Canada, July 8-12, 2007.
• “Data Center Cooling Prediction using Artificial Neural Network,” Saurabh K. Shrivastava, James W. Van Gilder and Bahgat Sammakia, Proceedings of IPACK 2007, IPACK2007-33432, Vancouver, BC, Canada, July 8-12, 2007.
• “Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell,” Siddharth Bhopte, Bahgat Sammakia, Madhusudan K. Iyengar and Roger Schmidt, Proceedings of IPACK 2007, IPACK2007-33540, Vancouver, BC, Canada, July 8-12, 2007.
• Siddharth Bhopte, Bahgat Sammakia and Bruce Murray, “Mixing enhancement in two component microchannel flow-Geometric and pulsed flow effects”,    Proceedings of IMECE2007 2007 ASME International Mechanical Engineering Congress and Exposition November 11-15, 2007, Seattle, Washington, USA.
• Harita Machiraju, Bill Infantolino, Bahgat Sammakia and Michael Deeds, “ Thermal analysis of MEMS actuator performance”, Proceedings of IMECE2007 2007 ASME International Mechanical Engineering Congress and Exposition November 11-15, 2007, Seattle, Washington, USA