Research

Research activities:

Research Contracts and Grant Awards – over $22.5M in sponsored funding for research activities since August 1998

2007-2008 (YTD)

National Science Foundation: IGERT, “Flexible Electronics for Biological and Life Science Applications (FlexEBio)”, participant and member of the steering committee, 2007-2012, first group of students to be recruited in 2008, ( joint project with Cornell University) $ 450,000, 9/1/07-8/31/2011.
National Science Foundation: NIRT - Nanostructured Bimetallic, Trimetallic and Core-Shell Fuel-Cell Catalysts with Controlled Size, Composition, and Morphology, 9/1/07-8/31/11, $1,000,000 (one of three co-principal investigators).
Army Research Laboratory: The Center for Advanced Microelectronics Manufacturing, 9/12/07-9/11/09, $1,652,740
NASA: Advanced Microelectronics Manufacturing Roll-to Roll Manufacturing of Microelectronics on Flexible Substrate, 11/1/07-10/31/09, $932,000
NYSTAR: CAT Renewal 2007-2008, 7/1/07-8/31/08, $1,000,000.
Texas Instruments: TI’s Membership in the CAMM, 9/1/07-8/31/08, $10,000.
Endicott Interconnect Technologies: EI’s Membership in the CAMM, 9/1/07-8/31/08, $20,000.
Corning Incorporated: Corning’s Membership in the CAMM, 9/1/07-8/31/08, $20,000.
Samsung Electronics Company: Samsung’s Affiliate Membership in the CAMM, 9/1/07-8/31/08, $50,000.
Samsung Electronics Company: Samsung’s Membership in the IEEC, 7/1/07-6/30/08, $20,000.
Corning, Incorporated: Green Laser Optoelectronic Packages for Consumer Applications, 7/1/07-6/30/08, $85,000.
Rohm and Haas membership in the CAMM, 1/1/08-12/31/08, $60,000.
Silk Displays affiliate membership in the CAMM, 1/1/08-12/31/08, $50,000.

2006-2007

DARPA: Integration and Packaging of Microelectronics on Flexible Substrates, 9/7/06-9/6/08, $979,895.
NYS Office of Science, Technology and Academic Research: CAT Program, 7/1/06-6/30/07, $1,000,000.
SUNY Albany (Semiconductor Research Corporation): Design Optimization of 3-D Stacked Wafers, 2/1/05-1/31/08, $90,000.
National Nuclear Security Administration: Detection Technology & Systems Research, 10/0/06-9/30/07, $48,928.
Amphenol Corporation: Participating Membership in the IEEC, 3/23/07-3/22/08, $3,500.
IBM: Support of the IEEC, 1/1/07-12/31/07, $60,000.
Boston Laser: Participating Membership in the IEEC, 4/15/07-4/14/08, $3,000.
Amphenol Corporation: Participating Membership in the IEEC, 3/23/06-3/22/07, $3,500.
Lockheed Martin Systems Integration: Support of the IEEC, 1/1/07-12/31/07, $60,000.
Prismark Partners: Tear Down Project, 9/1/06-8/31/07, $20,000.
General Electric: Full Membership in the CAMM, 9/1/06-8/31/07, $10,000.
STATS ChipPAC: Membership in the IEEC, 11/1/06-10/31/07, $40,000.
Endicott Research Group: Participating Membership in the IEEC, 3/19/07-3/18/08, $3,000.
Endicott Interconnect Technologies: Support of the IEEC, 4/1/06-3/31/07, $60,000.
BAE Systems Controls: Support of the IEEC, 1/1/07-12/31/07, $60,000.
IBM: Support of IEEC, 1/1/06-12/31/06, $60,000.
Prismark Partners: Tear Down Project, 9/1/06-8/31/07, $20,000.
Texas Instruments: Support of the IEEC, 9/1/06-8/31/07, $50,000.
Oak Mitsui: Participating Membership in the IEEC, 8/21/06-8/20/07, $10,000.
Corning, Inc.: Full Membership in the CAMM, 9/1/06-8/31/08, $30,000.
Analog Devices: Membership in the IEEC, 2/8/07-2/7/08, $60,000.
Endicott Interconnect Technologies: Full Membership in the CAMM, 9/1/06-8/31/07, $10,000.
Corning, Inc.: Membership in the IEEC, 10/1/06-9/30/07, $50,000.
Endicott Interconnect Technologies: Cash Grant to Support NYSTAR, 9/1/06-8/31/05, $23,438.
Analog Devices: Support of a Graduate Student Dedicated to ADI Projects, 5/1/07-5/30/08, $19,000.
NYSTAR: Ceramic Thin Film Embedded Capacitors for Emerging System-in-Packaging (SIP) Concepts, 9/1/06-8/31/08, $62,500

2005-2006

NYSTAR: Advanced Microelectronics Manufacturing on Flexible Substrates: The Next Revolution in Electronics Manufacturing, 3/1/06-2/28/09, $1,700,000.
NYSTAR: CAT Program, 7/1/04-6/30/06, $1,000,000.
SUNY Albany (Semiconductor Research Corporation): Design Optimization of 3-D Stacked Wafers, 2/1/05-1/31/07, $180,000.
National Nuclear Security Administration: Detection Technology & Systems Research, 10/1/05-9/30/06, $66,872.
Endicott Interconnect Technologies: Support of the IEEC, 4/1/05-3/31/06, $60,000.
U.S. Display Consortium: Center for Advanced Microelectronics Manufacturing, 1/3/05-1/2/09, $200,000.
Binghamton Semiconductor Packaging: Participating Membership in the IEEC, 7/1/05-6/30/06, $3,000.
BAE Systems Controls: Support of the IEEC, 1/1/06-12/31/06, $60,000.
General Electric: Support of the IEEC, 2/1/06-1/31/07, $60,000.
Amphenol Corporation: Participating Membership in the IEEC, 3/23/06-3/22/07, $3,500.
Samsung Electronics: Membership in the IEEC, 1/1/06-12/31/06, $40,000.
Analog Devices: Membership in the IEEC, 2/8/06-2/7/07, $60,000.
Prismark Partners: Tear Down Project, 9/1/05-8/31/06, $20,000.
Panavision SVI, LLC: Participating Membership in the IEEC, 5/1/06-4/30/07, $13,300.
STATS ChipPAC Ltd.: Full Membership to the IEEC, 11/1/05-10/31/06, $40,000.
Texas Instruments: Membership in the IEEC, 9/1/05-8/31/06, $40,000.
Oak-Mitsui: Participating Membership in the IEEC, 8/21/05-8/20/06, $10,000.
Lockheed Martin Systems Integration: Support of the IEEC, 1/1/06-12/31/06, $60,000.
NASA: Advanced Microelectronics Manufacturing Roll-to Roll Manufacturing of Microelectronics on Flexible Substrate, 11/1/05-10/31/07, $992,000.
Boston Laser: Participating Membership in the IEEC, 9/1/05-8/31/06, $3,000.
Corning, Inc.: Full Membership in the IEEC, 10/1/05-9/30/06, $40,000.
Edgewood Chemical Biological Center (U.S. Army): Development of Sentinel wireless Sensor Network, 9/22/05-9/12/07, $281,705.
Analog Devices: Support of a Graduate Student Dedicated to ADI Project, 5/1/06-5/30/07, $19,000

2004-2005

New York State Science, Technology and Academic Research: CAT Renewal, 7/1/04-6/30/05, $1,000,000.
U.S. Display Consortium: Center for Advanced Microelectronics Manufacturing, 1/3/08-1/2/10, $200,000.
Binghamton Semiconductor Packaging: Participating Membership in the IEEC, 7/1/04-6/30/05, $3,000.
Analog Devices: Membership in the IEEC, 2/8/05-2/7/06, $60,000.
Boston Laser: Membership in the IEEC, 9/1/04-8/31/05, $3,000.
Lockheed Martin Systems Integration Co.: Support of the IEEC, 1/1/05-12/31/05, $60,000.
Universal Instruments: Support of the IEEC, 1/1/05-12/31/05, $30,000.
IBM: Support of the IEEC, 1/1/05-12/31/05, $30,000.
Amphenol Corporation: Participating Membership of the IEEC, 3/23/05-3/22/06, $3,500.
Oak-Mitsui: Participating Membership in the IEEC, 8/21/04-8/20/05, $10,000.
BAE Systems Controls, Inc.: Support of the IEEC, 1/1/05-12/31/05, $60,000.
Boston Laser: Participating Membership in the IEEC, 9/1/04-8/31/05, $6,000.
Samsung: Membership in the IEEC, 1/1/05-12/31/05, $40,000.
General Electric Company: Support of the IEEC, 2/1/05-1/31/06, $70,000.
IBM: Membership in IEEC, 1/1/04-12/31/04, $60,000

2003-2004

NYSTAR: The Integrated Electronics Engineering Center, A New York State Designated Center for Advanced Technology, 7/1/03-6/30/04, $1,000,000.
Semiconductor Research Corporation: Nano-Structure Enhanced Thermal Interface Materials for the Next Generation of Electronics Packages, 7/1/03-9/30/04, $73,125.
Semiconductor Research Corporation: A Novel Coating Concept for Electronic and MEMS Packaging, 7/1/03-3/31/05, $75,000.
NSF: REU Site: Research Opportunities for Undergraduates in the Field of Electronics, 6/1/04-5/31/05, $48,940.
Analog Devices: Package Induced Die Stress Study, 10/1/03-9/30/04, $40,000.
Boston Laser: Participating Membership in IEEC, 9/1/03-8/31/04, $3,000.
Oak Mitsui: Participating Membership in the IEEC, 8/21/03-8/21/04, $10,000.
Infotonics Technology Center: 3D Wafer Level Packaging of Microsystems for Harsh Environments, 4/1/04-9/30/04, $25,000.
Endicott Interconnect Technologies: Support of the IEEC, 4/1/04-3/31/05, $50,000.
Samsung: Membership in the IEEC, 1/1/04-12/31/04, $40,000.
NYSERDA: Optimizing Airflow Management Protocols in New York Data Centers, 11/24/03-11/23/05, $247,533.
IBM: Support of the IEEC at BU, 12/17/02-12/16/03, $60,000.
Samsung Electronics: Study of Pb-Free Solder Interconnects, 1/1/04-12/31/04, $10,000.
Lockheed Martin Systems Integration: Support of the IEEC, 1/1/04-12/31/04, $60,000.
Semiconductor Research Corporation: Constitutive Model Development for Lead Free Solder Alloys at Multiple Specimen Scale, 9/03-8/31/04, $35,000.
HRSA: The Center for Protein Dynamics at the Innovative Technologies Complex, 9/1/03-9/30/04, $98,356.
Transit Video Security Systems: Participating Membership in the IEEC, 1/1/04-12/31/04, $3,000.
BAE Systems Controls: Support of the IEEC, 1/1/04-12/31/04, $60,000.
Universal Instruments: Support of the IEEC, 1/1/04-6/30/04, $30,000.
Analog Devices: Support of the IEEC, 2/8/04-2/7/05, $60,000.
Prismark Partners: Tear Down Project, 9/1/03-8/31/04, $20,000.
General Electric: Support of the IEEC, $60,000, 2/1/04-1/31/05, $60,000.
Binghamton Semiconductor Packaging: Participating Membership in the IEEC, 7/1/03-6/30/04, $3,000.
Amphenol Corporation: Participating Membership in the IEEC, 3/23/04-3/22/05, $3,500.
General Electric (NIST): Nanoengineered Thermal Interfaces for Next Generation Microelectronic Devices, 11/1/03-10/31/04, $98,690

2002-2003

NYSTAR, NYS Center for Advanced Technology in Electronics Packaging, 7/1/02-6/30/03, $1,000,000.
Semiconductor Research Corporation: Nano-Structure Enhanced Thermal Interface Materials for the Next Generation of Electronics Packages, 7/1/02-6/30/03, $48,751.
Semiconductor Research Corporation: Constitutive Model Development for Lead Free Solder Alloys at Multiple Specimen Scale, 9/1/02-8/31/03, $35,000.
General Electric (NIST Advanced Technology Program ATP): Nanoengineered Thermal Interfaces for Next Generation Microelectronics, 11/1/02-10/31/03, $94,322.
Transit Video Security Systems: Participating Membership in the IEEC, 01/01/03-12/31/03, $3,000.
Oak-Mitsui: Participating Membership in IEEC, 8/21/02-8/20/03, $10,000.
BAE Systems Controls: Support of the IEEC, 1/1/03-12/31/03, $60,000.
Prismark Partners: Tear Down Project, 9/1/02-8/31/03, $20,000.
Analog Devices: Die Delamination Study, 10/1/02-12/31/02, $5,921.
Universal Instruments: Support of the IEEC, 1/1/02-12/31/02, $60,000.
Rainbow Displays: Participating Membership in the IEEC, 1/1/02-12/31/02, $3,000.
Analog Devices: Support of the IEEC, 2/8/03-2/7/04, $50,000.
Analog Devices: Teardown of Six Switches, 11/15/02-2/14/03, $15,000.
General Electric: Stress Modeling for Flip Chip Technology, 10/15/02-12/31/02, $3,000.
Analog Devices: Investigation of Lid Sealing Failures, 8/1/02-1/31/03, $3,000.
Lockheed Martin Systems Integration: Support of the IEEC, 1/1/03-12/31/03, $60,000.
Analog Devices: Finite Element Modeling of a Flip Chip Package, 7/1/02-9/30/02, $4,400.
Analog Devices: Reliability Modeling of Ball Grid Array Packages Using Finite Element Analysis, 12/16/02-6/15/03, $3,812.
Binghamton Semiconductor Packaging: Participating Membership in the IEEC, 7/1/02-6/30/03, $3,000.
CUNY (Infotonics Technology Center): Compact Photonic Explorers, 10/1/02-9/30/03, $90,000.
General Electric: Membership in the IEEC, 2/1/03-1/31/04, $50,000.
Endicott Interconnects Technologies: Support of the IEEC, 4/1/03-3/31/04, $40,000

2001-2002

NSF, REU, Research Opportunities for Undergraduates in the Field of Electronics Packaging, 6/1/02-5/31/03, $48,940.
NYSTAR, NYS Center for Advanced Technology in Electronics Packaging, 7/01-7/02, $1,000,000.
Semiconductor Research Corporation: Nano-Structure Enhanced Thermal Interface Materials for the Next Generation of Electronic Packages, 07/01/02-08/31/02, $9,751.
Analog Devices, Inc,: Analog Devices’ Support of the IEEC, 01/07/01-01/06/03, $40,000.
National Semiconductor: Constitutive Model Development for Lead Free Solder Alloys at Multiple, 09/01/01-08/31/01, $23,100.
National Semiconductor: Wafer Level CSP Reliability Modeling, 01/01/01-06/30/02, $462.00.
Sanmina Corporation: Participating Membership in the IEEC, 06/01/01-05/31/03, $10,000.
Prismark Partners: Tear Down Project, 09/01/01-08/31/02, $20,000.
Rainbow Displays: Tiled Microdisplay Technology, 11/01/01-10/31/03, $23,577.
IBM: Support of the IEEC, 12/11/00-12/15/01, $65,000.
IBM: Support of the IEEC, 12/17/02-12/16/03, $60,000.
Photon Vision Systems: Participating Membership in the IEEC, 09/15/01-09/14/02, $3,000.
BAE Systems Controls: Support of the IEEC, 01/01/02-12/31/02, $50,000.
Lockheed Martin Systems Integration Company: Support of the IEEC, 01/01/02-12/31/02, $60,000.
Technology Consumer Products: Electronics Ballast Reliability Testing, 02/18/02-06/30/02.
Amphenol Aerospace Operations: Participating Membership in the IEEC, 06/01/02-05/31/03, $4,460.
General Electric: Support of the IEEC, 02/01/02-01/31/03, $50,000

2000-2001

NSF, REU Project Development of a Distributed Data Base System for an Internet-Based Multi-Campus Course, $5,000.
NYS Office of Science, Tech., & Academic Research: The Integrated Electronics Engineering Center, The New York State Center for Advanced Technology, 07/01/00-06/30/01, $1,000,000.
Rainbow Displays: Tiled Microdisplay Technology (NIST ATP), 11/01/00-0/31/01, $145,952.
Universal Instruments: Support of the IEEC, 01/01/00-02/31/00, $70,000.
Mitsui: Participating Membership in the IEEC, 11/01/00-0/31/01, $10,000.
General Electric: Membership in the IEEC, 02/01/01-01/31/02, $40,000.
Universal Instruments: Support of the IEEC, 01/01/01-02/31/01,$65,000.
Lockheed Martin Systems Integration: Support of the IEEC, 01/01/01-02/31/01, $60,000.
Photomechanics: Participating Membership in the IEEC, 03/01/01-02/28/01, $3,000.
Rainbow Displays: Participating Membership in the IEEC, 01/01/01-02/31/01, $3,000.
International Flex Technologies: Support of the IEEC, 03/01/01-02/28/02, $50,000.
National Semiconductor: Wafer Level CSP Reliability Modeling, 01/01/01-02/31/01, $5,987.
Cryomedical Sciences: Participating Membership in the IEEC, 07/01/00-06/30/01, $3,000.
Nortel Networks: Design for Cooling for Electronics Assemblies, 01/24/01-01/24/02, $30,000.
BAE Systems Controls: Support of the IEEC, 01/01/01-02/31/01, $40,000.
Prismark Partners: Tear Down Project, 09/01/00-08/31/01, $20,000.
Sanmina Corporation: Participating Membership in the IEEC, 09/25/00-09/24/01, $3,000.
Cryomedical Sciences: Investigation of Freezing of Biological Tissue, 10/15/00-0/14/01, $15,964

1999-2000

NYSTAR, NYS Center for Advanced Technology in Electronics Packaging, 7/99-7/2000, $1,250,000.
NSF: Small Firms Collaborative R&D Project with Rainbow Displays, Endicott, NY, January 1, 1999-December 31, 2000, $200,000.
Binghamton Semiconductor Packaging: Participating Membership in the IEEC, 202/08/00-02/07/01, $3,000.
Lockheed Martin Federal Systems: Support of the IEEC, 01/01/00-02/31/00, $45,000.
IBM: Support of the IEEC, 02/17/99-02/16/00, $70,000.
Lockheed Martin Control Systems: Support of the IEEC, 01/01/00-02/31/00, $45,000.
Eastman Kodak: Participating Membership in the IEEC, 12/01/99-01/30/00, $10,000.
Rainbow Displays: Participating Membership in the IEEC, 01/01/00-02/31/00, $3,000.
Photomechanics, Inc.: Participating Membership in the IEEC, 03/01/00-02/2/000, $3,000.
NYS Science and Technology Fdn: The NYS Center for Advanced Technology in Electronics Packaging, 07/01/99-06/30/00, $1,215,000.
International Flex Technologies: Membership in the IEEC, 03/01/00-02/27/01, $40,000.
Matco Electronics Group: Support of the IEEC, 03/01/00-02/28/01, $50,000.
Prismark Partners: Tear Down Project, 09/01/99-08/31/00, $$20,000.
International Flex Technologies: Membership in the IEEC, 10/01/99-09/30/00, $20,000.
Performance Interconnects: Participating Membership in the IEEC, 11/01/99-09/31/00, $3,000.
Johnson Matthey Electronics: Support of the IEEC, 10/01/99-09/30/00, $40,000.
U-Neek Solutions: Participating Membership in the IEEC, 03/01/00-02/28/01, $3,000

1998-1999

Rochester Institute of Technology: Characterization of Adhesive Dot Diameters, 02/05/99-05/07/99, $1,800.
IBM: IBM’s Support of the IEEC at Binghamton University, 01/01/99-12/31/99, $45,000.
Lockheed Martin Control Systems: Lockheed Martin Control Systems’ Support of the IEEC, 01/01/99-12/31/99, $50,000.
Lockheed Martin Federal Systems: Lockheed Martin Control Systems’ Support of the IEEC, 01/09/99-12/31/99, $50,000.
Rainbow Displays: Rainbow Displays’ Participating Membership in the IEEC, 01/01/99-12/31/99, $3,000.
Prismark Partners, LLC: Teardown Project, 09/01/98-08/31/99, $20,000.
Universal Instruments: Universal Instruments’ Support of the IEEC, 01/01/98-12/31/98, $83,333.
Universal Instruments: Universal Instruments’ Support of the IEEC, 01/01/99-12/31/99, $75,000.
Teltech Resource Network: Thermal Management for Electronics Packaging, 10/15/99-2/31/99, $5,999

Tel: 607 777-6880
Bahgat G. Sammakia bahgat@binghamton.edu