Services:

  • Co Chair, Academic Track, United States Displays Consortium Annual Flexible Electronics and Displays Conference and Exhibit, Phoenix, AZ, February 2008
  • Chief editor of the ASME Transactions, Journal of Electronic Packaging since January 2002
  • Technical editor ASME Transactions, Journal of Electronic Packaging, 1989 to 1995.
  • Associate editor IEEE Transactions on Components and Packaging Technologies, 2006.
  • Member ASME K-16 subcommittee on thermal management of electronic equipment since 1985.
  • IBM STAB member for packaging at the Semiconductor Research Corporation (SRC) 1997/98. Reviewed and evaluated research activities related to packaging at the Univ. of Arizona, Stanford, Cornell, Lehigh, Wayne State University, Univ. of Texas at Austin, and University of Colorado at Boulder.
  • Served on the science committee for Thermes 2002, a workshop dedicated to future challenges and needs in the thermal management of Electronics, Santa Fe, NM, 1/2002.
  • Organized and chaired a session on thermal issues in manufacturing of Electronics Packaging, Thermes 2002, Santa Fe, NM, 1/2002.
  • Chaired and coordinated sessions on thermal management, structural mechanics and reliability in electronic packaging at ASME sponsored conferences, including:
    • Co-Chair, (with Prof. Ganesh Subbarayan, Purdue University), the Electronics Packaging track at the 2002 ASME IMECE           
    • Track chair for the thermal track at Itherm 2002.  Coordinated and organized 22 sessions at the conference all related to thermal management of Electronics Packages and Systems.
    • Organized and chaired a session on thermal management of electronics at the IMECE 2001, N.Y.
    • Organized and chaired 1 session at ASME/IMECE1999
    • Organized and participated in two panel sessions at the Itherm ‘98 related to coupling effects in organic flip chip packages, and thermal induced phenomena at thermal interfaces.
    • Organized and chaired two sessions at Itherm 98
    • Organized and chaired ome session at ASME/IMECE 1998
    • Organized two sessions at the Inter-pack meeting in 1995, Maui.
    • Organized a session at the Fourth Intersociety Conference on Thermal Phenomena in Electronic Systems, Washington, DC, May 4-7 1994.
    • ASME/JSME International conference on electronic packaging, Milpitas CA, 1993
    • Chaired two sessions at the ASME International Packaging Conference, Binghamton, NY 1993.

     

  • Newsletter editor for the ASME K-16 subcommittee on thermal management of Electronic Packaging from 85-88.
  • NEMI member of the modeling and simulation group for 2000, 2002.
  • NEMI member of the thermal management group for 2000.

 

Campus Service:

  • Chair, search committee for new faculty in the ME department 2003.
  • Serving on the IPC for the SSIE department, 1999, 2000, 2001, 2002, 2003.
  • Served on the IPC for the ME department 1999, 2000, 2001, 2002, 2003.
  • Served on the IPC for the Materials Science program 2001, 2002, 2003.
  • Search committee for new faculty in the IE department, 1999, 2000.
  • Search committee for new faculty in the ME department, 1999, 2000, 2001, 2002.
  • Research committee for the Watson School of Engineering 1999, 2000, 2001, 2003.
  • Packaging education committee for the Watson School of Engineering 1999, 2000, 2001, 2002, 2003.
  • Served on the search committee for the Dean of Engineering 2000.

 

Teaching innovation:

  • “Fundamentals of Electronics Packaging”” Watson 582, was developed in 1999.  The course was offered again in 2000.  Student registration in the course increased from 36 in 1999 to 52 in 2000.  The student breakdown was 47 graduates and 5 undergraduates.  Fourteen of the students were on Enginet, and several of them were at different industrial settings around the country.  The course was presented by six faculty members from the Watson School, Chemistry and Physics.  This course continues into 2005
  • Organized and managed the senior design class for the department of mechanical engineering.  Twelve projects from industry were split amongst the students in typical teams of 3-5 students.  Many of the projects were electronics-packaging related and two of them were in the area of Biomedical devices. 

Professional courses:

“Thermal Design of Electronic Equipment: From Portables to Mainframes,” B. Sammakia, Y. Joshi, S. Sathe and D. Agonafer, taught at:

  • Semi-Therm conference, San Jose CA, February 1995
  • Itherm conference Seattle, WA, June 1998
  • InterPack conference 1997

Independent study courses:

  • 6 students supervised in 1999
  • 14 students supervised in 2000
  • 8 students supervised in 2001
  • 4 students supervised in 2005
  • 2 students supervised in 2006
  • 4 students supervised in 2007

                                            Tel: 607 777-6880    
Bahgat G. Sammakia              bahgat@binghamton.edu