Graduated Advisees:
PhD:
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Thermal Management of Small Scale Electronic Systems,” Anand Desai, PhD Dissertation, Mechanical Engineering, 2006
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“Die stress analysis in plastic encapsulated electronic packages- an experimental and numerical approach” Satish Chaparala, PhD Dissertation, Mechanical Engineering, 2006
MS:
- “Computational Parameter Study of Chip Scale Package Array Cooling,” Sean Watson, MS, Mechanical Engineering, 2000.
- “Numerical Analysis of a Tape Ball Grid Array (TBGA) Package,” Satish Gutikonda, MS, Mechanical Engineering, 2001.
- “Selection of Fatigue Life Prediction Under Random Loading,” Amit Awasthi, MS, Mechanical Engineering, 2001.
- “Towards the Optimization of Air Cooled Heat Sinks for Microprocessors,” Amit Shah, MS, Industrial Engineering, 2002.
- “Modeling and Reliability Analysis of Wafer-Level Chip Scale Packaging,” Satish Chaparala, MS, Mechanical Engineering, 2002.
- “Study of Assembly Processes for Liquid Crystal on Silicon (LCOS) Microdisplays,” Anupam Choubey, MS, Mechanical Engineering, 2003.
- “Selection of Method for Fatigue Life Prediction Under Random Loading,” Amit Awasthi, MS. Mechanical Engineering, 2003.
- “Thermal Management of Biomaterials in a Rectangular Cavity Surrounded by a Phase Change Material,” Saurabh Shrivastava, MS, Mechanical Engineering, 2004.
- “Thermomechanical Issues of a Ball Light Collimator in Liquid Crystal Displays,” Satej Bidwe, MS, Mechanical Engineering, 2005.
- “A Study of Nanostructure Enhanced Thermal Interface Material,” Anand Desai, MS, Mechanical Engineering, 2006.
- “Development and Verification of an Apparatus for Thermal Resistance and Thermal Conductivity Measurements,” Kaustubh Kalkuindri, MS, Mechanical Engineering, 2006.
- “Comparative Analysis of Microchannel Heat Sink Configurations Subject to a Pressure Constraint,” Dylan Farnam, MS, Mechanical Engineering, 2007
Tel: 607 777-6880
Bahgat G. Sammakia bahgat@binghamton.edu
Bahgat G. Sammakia bahgat@binghamton.edu
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